FR-4 ENIG 2layer HDI Circuit Board Prototype AOI PCB SMT Assembly
PCB SMT Assembly Introduction
Surface mount technology(SMT) is an area of electronic PCB assembly. SMT PCB fabricating & assembly does not only includes placing and soldering of components but also a wide array productions. We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs.
PCB CAPABILITIES
| Layers | 1 - 46 L (Custom ) |
| Substrate | FR-4,CTI600,Tg180,,Anti CAF,Halogen-free,,High frequency,Tg170&HF |
| Max. panel size | 700x610mm (Custom) |
| Board thickness | 0.3 mm - 3.5 mm. |
| Copper thickness | 1/3 oz. to 6 oz. (outer) (Max) |
| Hole | > 0.15mm. |
| Aspect Ratio | 10 : 1 |
| Min. track width | 3.0 mils(partial) |
| Min. track space | 3.0mils(partial) |
| Min. S/M bridge | 3mil |
| Hole plugging diameter | 0.3 mm~0.55 mm. |
| Impedance tolerance | +/- 10%. |
| Color of S/M | green,white,black,red,orange,yellow,blue,purple |
| Surface treatment | OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable soldermask,Carbon ink print,Selective hard gold |
PCBA CAPABILITIES
| PCBA Capability |
| Material Type | Item | Min | Max |
| PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
| Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC |
| Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger |
| Components | Chip&IC | 1005 | 55mm |
| BGA Pitch | 0.3mm | - |
| QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
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PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
Our advantages
| 1.Service value Independent quotation system to quickly serve the market | 2.PCB manufacturing High-tech PCB and PCB assembly production line |
| 3.Material purchasing A team of experienced electronic component procurement engineers | 4.SMT post soldering Dust-free workshop, high-end SMT patch processing |
PCB SMT Assembly Delivery Time
| Product Type | Qty | Normal lead time | Quick-turn lead time |
| SMT+DIP | 1-50 | 1WD-2WD | 8H |
| SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
| SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
| SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
| PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
| PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
| PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
| PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
| PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
| PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
| PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
PCB SMT Assembly Application Field
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
Workshop
Common packaging
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Product Tags:
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FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype Images
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